Sung-gyu Kang

Title: Innovations of Sung-gyu Kang in Silicon Direct Bonding

Introduction

Sung-gyu Kang is a notable inventor based in Suwon-Si, South Korea. He has made significant contributions to the field of silicon technology, particularly through his innovative methods that enhance the bonding process of silicon substrates.

Latest Patents

One of his key patents is the Silicon Direct Bonding (SDB) method. This method addresses the issue of void formation caused by gases during the bonding process. The SDB method involves preparing two silicon substrates with corresponding bonding surfaces, forming trenches in at least one of the bonding surfaces, and creating gas discharge outlets that penetrate the bonding surface. This innovative approach allows for the effective discharge of gases generated during thermal treatment, thereby preventing voids from forming at the junctions of the silicon substrates.

Career Highlights

Sung-gyu Kang has been recognized for his expertise in silicon bonding techniques. His work has contributed to advancements in semiconductor manufacturing and has implications for various applications in electronics. His patent demonstrates a deep understanding of material science and engineering principles.

Collaborations

Sung-gyu Kang has collaborated with fellow inventor Seung-mo Lim, further enhancing the innovative capabilities within their field. Their partnership exemplifies the importance of teamwork in driving technological advancements.

Conclusion

Sung-gyu Kang's contributions to silicon technology through his patented SDB method highlight his role as a significant inventor in the industry. His work not only addresses critical challenges in silicon bonding but also paves the way for future innovations in semiconductor manufacturing.