Taoyuan, Taiwan

Sung-Feng Yeh

This inventor holds 1 USPTO granted patent. Top assignee: Nan Ya Pcb Corp.. Active years: 2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sung-Feng Yeh. Retrieved from https://idiyas.com/inventor/sung-feng-yeh-uu0jun8m

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Sung-Feng Yeh

Introduction

Sung-Feng Yeh is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of circuit board technology. His innovative work has led to the development of a unique cutting mold for rigid-flexible circuit boards.

Latest Patents

Sung-Feng Yeh holds a patent for a "Cutting mold for rigid-flexible circuit board and method for forming the same." This invention involves a cutting mold designed to remove two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. The design includes a first cutter connected to a first moldboard, along with a first barricade that is also connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is positioned opposite the first moldboard, and both moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter, while a second barricade detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard also exceeds that from the second cutter to the second moldboard. This innovative design allows the first and second cutters to effectively cut the superfluous rigid circuit boards when the moldboards move toward each other. Sung-Feng Yeh has 1 patent to his name.

Career Highlights

Sung-Feng Yeh is currently employed at Nan Ya PCB Corporation, a leading company in the printed circuit board industry. His work at this organization has allowed him to further develop his skills and contribute to advancements in circuit board technology.

Collaborations

Throughout his career, Sung-Feng Yeh has collaborated with talented individuals such as Yu-Lun Lin and Chih-Ming Lin. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Sung-Feng Yeh's contributions to the field of circuit board technology exemplify the spirit of innovation. His patented cutting mold design showcases his ability to solve complex problems in the industry. His work continues to influence the development of advanced circuit board solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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