Location History:
- Changhwa Hsien, TW (2001)
- Kaohsiung, TW (2010 - 2014)
Company Filing History:
Years Active: 2001-2014
Title: Innovations by Sung-Ching Hung in Semiconductor Packaging
Introduction
Sung-Ching Hung is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on improving the efficiency and cost-effectiveness of semiconductor devices.
Latest Patents
One of his latest patents is a semiconductor package that includes a carrier, a semiconductor device, and two wires of different lengths. This design reduces material usage and manufacturing costs by optimizing the connection between the semiconductor device and the carrier. Another important patent is for a stacked semiconductor package, which features a carrier and two semiconductor devices stacked on top of each other. This innovation also employs wires of varying diameters to minimize material usage and reduce costs.
Career Highlights
Sung-Ching Hung is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency of semiconductor packaging.
Collaborations
He collaborates with talented coworkers such as Wen-Pin Huang and Ming-Shuoh Liang, contributing to a dynamic team focused on innovation in the semiconductor industry.
Conclusion
Sung-Ching Hung's contributions to semiconductor packaging demonstrate his commitment to innovation and efficiency. His patents reflect a deep understanding of the industry's needs and a drive to improve manufacturing processes.