This inventor holds 1 USPTO granted patent. Top assignee: Avery Dennison Corporation. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Innovations by Sundar Rajan in Multilayered Shrink Films
Introduction
Sundar Rajan is an accomplished inventor based in Mentor, OH (US). He has made significant contributions to the field of materials science, particularly in the development of multilayered shrink films. His innovative work has led to the creation of a unique product that is both functional and environmentally friendly.
Latest Patents
Sundar Rajan holds a patent for "Multilayered shrink films and labels made therefrom." This invention relates to a halogen-free, multilayered, uniaxially oriented heat shrink film. The film comprises a core layer made from a blend of polyolefins, with a first skin layer on the upper surface and a second skin layer on the lower surface. Both skin layers independently consist of a polyolefin blend, and the film exhibits a shrinkage of at least about 40% in the machine direction at 270°F. Additionally, the invention includes a label with an adhesive applied to at least one of the skin layers, which is used to encapsulate various articles.
Career Highlights
Sundar Rajan is associated with Avery Dennison Corporation, a leading company in the materials and labeling industry. His work at Avery Dennison has allowed him to focus on innovative solutions that meet the needs of modern packaging and labeling.
Collaborations
Throughout his career, Sundar has collaborated with notable colleagues, including John E Kovalchuk and Christopher J Blackwell. These collaborations have contributed to the advancement of technology in the field of shrink films and labels.
Conclusion
Sundar Rajan's contributions to the development of multilayered shrink films demonstrate his commitment to innovation and sustainability. His patent reflects a significant advancement in packaging technology, showcasing his expertise and dedication to the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
