Tokyo, Japan

Sunao Yasui

This inventor holds 1 USPTO granted patent. Top assignee: Nec Corporation. Active years: 1987.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sunao Yasui. Retrieved from https://idiyas.com/inventor/sunao-yasui

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 1987

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Sunao Yasui: A Pioneer in Multi-Layer Printed Wiring Boards

Introduction: Sunao Yasui is an esteemed inventor based in Tokyo, Japan, known for his significant contribution to the field of electronics through his patent on multi-layer printed wiring boards. With a focus on enhancing the efficiency and functionality of electronic components, Yasui embodies the spirit of innovation that propels technological advancement.

Latest Patents: Sunao Yasui holds a patent for a novel method of making multi-layer printed wiring boards. This invention features an internal board with a wiring pattern on both sides, complemented by two conductive plates that establish respective voltage planes. These conductive plates are innovatively designed with grooves that align with the wiring pattern of the internal board, creating a cohesive and functional assembly. This multi-layer design is enhanced by the addition of intermediate insulating layers, resulting in a robust electronic component that supports insulated wiring patterns on the exterior sides of the conductive plates.

Career Highlights: Yasui is associated with NEC Corporation, a leader in advanced electronic communications and technology. His tenure at NEC has allowed him to delve deep into research and development, solidifying his expertise in printed wiring technologies. His innovative approach has led to the creation of cutting-edge solutions that cater to the evolving demands of the electronics industry.

Collaborations: Throughout his career, Sunao Yasui has collaborated with notable colleagues, including Hidebumi Ohnuki and Toshiaki Asano. Together, they have contributed to the development of advanced electronic solutions, driving forward the boundaries of technology and innovation.

Conclusion: Sunao Yasui's work exemplifies the transformative power of innovation in the field of electronics. His patent for the multi-layer printed wiring board not only reflects his ingenuity but also the collaborative spirit that characterizes the modern technological landscape. As a key figure at NEC Corporation, Yasui continues to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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