Beijing, China

Sun Ree

This inventor holds 1 USPTO granted patent. Top assignee: Emc IP Holding Company LLC. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sun Ree. Retrieved from https://idiyas.com/inventor/sun-ree

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: The Innovations of Sun Ree

Introduction

Sun Ree is a notable inventor based in Beijing, China. He has made significant contributions to the field of data storage technology. His innovative approach focuses on enhancing the efficiency of RAID (Redundant Array of Independent Disks) systems.

Latest Patents

Sun Ree holds a patent for the "Assignment of newly added data storage drives to an original data storage drive partnership group and a new data storage drive partnership group in a mapped RAID system." This technology aims to avoid wasted capacity in a hybrid array of data storage drives. The patent outlines a method for adding drives from a set of new drives to an original partnership group, ensuring that the number of highest capacity drives meets the minimum requirements for RAID data protection.

Career Highlights

Sun Ree is currently employed at Emc IP Holding Company LLC, where he continues to develop innovative solutions in data storage. His work has been instrumental in advancing RAID technology, making it more efficient and reliable.

Collaborations

Some of Sun Ree's coworkers include Sheng Wang and Jibing Dong, who contribute to the collaborative environment that fosters innovation within their team.

Conclusion

Sun Ree's contributions to data storage technology exemplify the spirit of innovation. His patent reflects a commitment to improving efficiency in RAID systems, showcasing his role as a leading inventor in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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