Kangawa-ken, Japan

Sumito Nii

This inventor holds 1 USPTO granted patent. Top assignee: Nippon Polyurethane Industry Co., Ltd.. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sumito Nii. Retrieved from https://idiyas.com/inventor/sumito-nii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: The Innovations of Sumito Nii

Introduction

Sumito Nii is a notable inventor based in Kanagawa-ken, Japan. He has made significant contributions to the field of materials science, particularly in the development of innovative packing solutions. His work has led to advancements that benefit various industries.

Latest Patents

Sumito Nii holds a patent for a "Composition for production of cover packing and process for production of cover packing using the same." This invention showcases his expertise in creating effective and efficient packing materials, which are essential for protecting products during transportation and storage. He has 1 patent to his name, reflecting his commitment to innovation.

Career Highlights

Nii is currently employed at Nippon Polyurethane Industry Co., Ltd., a company known for its advancements in polyurethane technology. His role at the company allows him to apply his inventive skills to real-world applications, contributing to the development of high-quality materials.

Collaborations

Throughout his career, Sumito Nii has collaborated with talented individuals such as Hiroei Yokota and Osamu Takata. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking solutions.

Conclusion

Sumito Nii's contributions to the field of packing materials exemplify the importance of innovation in industry. His work not only enhances product safety but also demonstrates the potential for continued advancements in materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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