Sumio Shimooka

Title: **Innovator Spotlight: Sumio Shimooka**

Introduction

Sumio Shimooka, an inventive mind from Kita-adachi-gun, Japan, has made significant strides in the realm of flexible printed circuit technology. With a focus on creating efficient materials that enhance electronic devices, Shimooka embodies the spirit of innovation in the modern age of electronics.

Latest Patents

Shimooka holds a notable patent for a thermosetting adhesive sheet, along with its application in a reinforcement-part-equipped flexible printed circuit. This innovative adhesive solution eliminates the necessity of a metal reinforcement sheet—a common contributor to the increased thickness in electronic devices—effectively preventing component detachment and warping. The thermosetting adhesive sheet integrates woven fabric, nonwoven fabric, or a thin metal base with a strategic adhesive layer, ensuring impressive electrical conductivity and durability.

Career Highlights

Presently, Shimooka is affiliated with Dic Corporation, where he utilizes his skills and knowledge to enhance product offerings. His commitment to advancing technology, particularly in flexible printed circuits, speaks to his dedication as an inventor and a key player in his field.

Collaborations

Throughout his career, Shimooka has collaborated with talented coworkers, including Koji Hayashi and Shota Tanii. These partnerships have facilitated knowledge exchange and contributed to the development of innovative solutions in their respective projects.

Conclusion

Sumio Shimooka’s contributions to the field of electronics through his innovative patents exemplify the continuous evolution of technology. His work, driven by a desire to improve device efficiency and functionality, remains instrumental in shaping the future of flexible printed circuits. As researchers and companies continue to advance technology, inventors like Shimooka are pivotal in turning concepts into reality.