logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10426044 B1

PDFFull Text
Date of Patent:
Sep. 24, 2019

Filed:

Dec. 06, 2016

Thermosetting adhesive sheet, reinforcement-part-equipped flexible printed circuit, method for manufacturing reinforcement-part-equipped flexible printed circuit, and electronic device

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Koji Hayashi, Ichihara, JP;

Sumio Shimooka, Kitaadachi-gun, JP;

Shota Tanii, Kitaadachi-gun, JP;

Akinori Morino, Kitaadachi-gun, JP;

Assignee:

DIC CORPORATION, Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H01K 1/02 (2006.01); H01K 1/18 (2006.01); H01K 3/00 (2006.01); H01K 3/24 (2006.01); H01K 3/32 (2006.01); H01L 21/02 (2006.01); H01L 23/48 (2006.01); H05K 3/38 (2006.01); C09J 201/00 (2006.01); C09J 7/35 (2018.01); C09J 7/25 (2018.01); C09J 7/28 (2018.01); C09J 7/21 (2018.01); C09J 7/20 (2018.01); C09J 5/06 (2006.01); C09J 11/04 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); C09J 9/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); C09J 5/06 (2013.01); C09J 7/205 (2018.01); C09J 7/21 (2018.01); C09J 7/255 (2018.01); C09J 7/28 (2018.01); C09J 7/35 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 201/00 (2013.01); H05K 1/028 (2013.01); H05K 1/0281 (2013.01); H05K 3/4644 (2013.01); C08K 2201/001 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2205/106 (2013.01); C09J 2400/16 (2013.01); C09J 2400/163 (2013.01); C09J 2463/00 (2013.01); C09J 2467/005 (2013.01); C09J 2467/006 (2013.01); H05K 3/0058 (2013.01); H05K 2203/1105 (2013.01);
Abstract

An object of the present invention relates to a thermosetting adhesive sheet that, without the use of a metal reinforcement sheet, which is regarded as a major factor responsible for an increase in thickness of electronic devices and other devices, reinforces a flexible printed circuit to such a level that detachment of mounted components, for example, is prevented, prevents warping, and has good electrical conductivity. The present invention relates to a thermosetting adhesive sheet configured to be used to reinforce a flexible printed circuit. The thermosetting adhesive sheet includes a woven fabric, a nonwoven fabric, or a metal base of 50 μm or less thickness and a thermosetting adhesive layer adjacent to at least one surface of the woven fabric, the nonwoven fabric, or the metal base of 50 μm or less thickness.

Find Patent Forward Citations

Loading…