Arlington Heights, IL, United States of America

Sumio Goto

This inventor holds 1 USPTO granted patent. Top assignee: Morton International, Inc.. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sumio Goto. Retrieved from https://idiyas.com/inventor/sumio-goto-aiscmtsv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1998

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovations of Sumio Goto

Introduction

Sumio Goto is a notable inventor based in Arlington Heights, IL (US). He has made significant contributions to the field of materials science, particularly in the development of adhesive compositions. His work has been instrumental in enhancing the bonding capabilities of various resin layers.

Latest Patents

Sumio Goto holds 1 patent for an innovative extrudable resin for polystyrene and laminate. This extrudable adhesive composition is designed to bond a layer of polystyrene resin to a layer of a second resin. The invention addresses the need for effective adhesion in composite materials, showcasing Goto's expertise in polymer chemistry.

Career Highlights

Throughout his career, Goto has been associated with Morton International, Inc., a company known for its advancements in specialty chemicals and materials. His role at Morton has allowed him to focus on research and development, leading to impactful innovations in adhesive technologies.

Collaborations

Sumio Goto has worked alongside talented colleagues, including Mark S. Pucci and John Machonis, Jr. Their collaborative efforts have contributed to the success of various projects within the company.

Conclusion

Sumio Goto's contributions to adhesive technology and materials science highlight his innovative spirit and dedication to advancing the field. His patent for an extrudable resin exemplifies the importance of effective bonding solutions in modern applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…