Kumamoto, Japan

Sumiko Komiya


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: Sumiko Komiya: Innovator in Epoxy Resin Technology

Introduction

Sumiko Komiya is a prominent inventor based in Kumamoto, Japan. She has made significant contributions to the field of materials science, particularly in the development of epoxy resin-based curable compositions. Her innovative work has implications for the semiconductor industry, where high-performance materials are essential.

Latest Patents

Sumiko Komiya holds a patent for an epoxy resin-based curable composition. This invention provides a novel solution suitable for use as an encapsulating resin composition for semiconductor devices. The composition is designed to be highly resistant to crack formation while maintaining low internal stress during curing. Additionally, it boasts high heat conductivity and a high glass transition temperature. The inventive composition includes a curable epoxy resin blend, a block copolymer, and optionally an inorganic filler, such as silica.

Career Highlights

Komiya is associated with Shin-Etsu Chemical Co., Ltd., a leading company in the chemical industry. Her work at this organization has allowed her to focus on innovative materials that enhance the performance of semiconductor devices. With her expertise, she has contributed to advancements that are crucial for modern electronics.

Collaborations

Throughout her career, Sumiko Komiya has collaborated with notable colleagues, including Kunio Itoh and Toshio Shiobara. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Sumiko Komiya's contributions to epoxy resin technology exemplify her commitment to innovation in materials science. Her patented work not only addresses critical challenges in the semiconductor industry but also showcases her role as a leading inventor in her field.

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