Sukhminder S Binapal

Title: The Innovative Mind of Sukhminder S Binapal

Introduction

Sukhminder S Binapal is a notable inventor based in Burlington, CA. He has made significant contributions to the field of multi-chip module (MCM) assembly technology. His innovative approach has led to the development of a unique patent that enhances circuit density and design flexibility.

Latest Patents

Sukhminder holds a patent for a "Three dimensional packaging configuration for multi-chip module assembly." This invention features three stacked integrated circuit (IC) layers, where the first IC layer is electrically flip-chip connected to a substrate. The second IC layer is glued to the back of the first layer, while the second and third layers are electrically flip-chip connected to each other. This design allows for high circuit density and lower electrical noise susceptibility, accommodating various IC sizes and technologies within a single assembly.

Career Highlights

Sukhminder is currently associated with Gennum Corporation, where he continues to innovate in the field of electronics. His work focuses on enhancing the performance and flexibility of multi-chip assemblies, making significant strides in the industry.

Collaborations

Throughout his career, Sukhminder has collaborated with talented individuals such as Robert E Hawke and Lynn McNeil. These partnerships have contributed to the advancement of technology in the field of integrated circuits.

Conclusion

Sukhminder S Binapal's contributions to multi-chip module technology exemplify the spirit of innovation. His patent reflects a commitment to improving electronic design and functionality. His work continues to influence the industry and inspire future advancements.