Icheon, South Korea

Suk Won Lee

This inventor holds 2 USPTO granted patents. Top assignee: Skhynix Inc.. Active years: 2023-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Suk Won Lee. Retrieved from https://idiyas.com/inventor/suk-won-lee-v6b880fh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2023-2024

Loading Chart...
2 patents (USPTO):Explore Patents

Title: The Innovations of Suk Won Lee

Introduction

Suk Won Lee is a notable inventor based in Icheon, South Korea. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, Lee continues to push the boundaries of innovation in his industry.

Latest Patents

One of his latest patents involves semiconductor packages that include at least one die position checker. This innovative semiconductor package features a first die disposed on a package substrate, with a second die stacked on top of the first die. The first position checker is also included on the package substrate, indicating a first position allowable range in which a first side of the first die can be located. This technology enhances the precision and reliability of semiconductor packaging.

Career Highlights

Suk Won Lee is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work at SK Hynix has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

One of his notable coworkers is Bok Gyu Min. Together, they work on innovative projects that aim to improve semiconductor packaging and performance.

Conclusion

Suk Won Lee's contributions to semiconductor technology through his patents and work at SK Hynix Inc. highlight his role as a key innovator in the field. His ongoing efforts continue to shape the future of semiconductor packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…