Sue May Jessup

Title: Sue May Jessup: Innovator in RF Technology

Introduction

Sue May Jessup is a prominent inventor based in Windham, NH (US). She has made significant contributions to the field of radio frequency (RF) technology. Her innovative work has led to the development of a unique patent that addresses critical challenges in semiconductor design.

Latest Patents

Sue May Jessup holds a patent for the "Method and design of an RF thru-via interconnect." This invention features a vertical metalized transition in the form of a via that extends from the back side of a high thermal conductivity substrate through any semiconductor layers. The design includes a patterned metalized strip, with the substrate having a patterned metalized layer on the back side. This layer is equipped with a keep away zone that is dimensioned to provide impedance matching for RF energy. This innovative approach allows heat generated by the semiconductor device to flow through the substrate and to a heat sink, ensuring efficient thermal management.

Career Highlights

Sue May Jessup is currently employed at BAE Systems Information and Electronic Systems Integration Inc. Her work at this esteemed company has allowed her to collaborate with other talented professionals in the field.

Collaborations

Some of her notable coworkers include Robert Actis and Pane-Chane Chao. Their collective expertise contributes to the advancement of technology in their respective areas.

Conclusion

Sue May Jessup's contributions to RF technology exemplify her innovative spirit and dedication to advancing the field. Her patent reflects her commitment to solving complex engineering challenges.