The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2015
Filed:
Jul. 18, 2012
Robert Actis, Burlington, MA (US);
Pane-chane Chao, Nashua, NH (US);
Robert J. Lender, Jr., Pepperell, MA (US);
Kanin Chu, Nashua, NH (US);
Bernard J. Schmanski, Merrimack, NH (US);
Sue May Jessup, Windham, NH (US);
Robert Actis, Burlington, MA (US);
Pane-chane Chao, Nashua, NH (US);
Robert J. Lender, Jr., Pepperell, MA (US);
Kanin Chu, Nashua, NH (US);
Bernard J. Schmanski, Merrimack, NH (US);
Sue May Jessup, Windham, NH (US);
BAE Systems Information and Electronic Systems Integration Inc., Nashua, NH (US);
Abstract
In summary, a vertical metalized transition in the form of a via goes from the back side of a high thermal conductivity substrate and through any semiconductor layers thereon to a patterned metalized strip, with the substrate having a patterned metalized layer on the back side that is provided with a keep away zone dimensioned to provide impedance matching for RF energy coupled through the substrate to the semiconductor device while at the same time permitting the heat generated by the semiconductor device to flow through the high thermal conductivity substrate, through the back side of the substrate and to a beat sink.