Company Filing History:
Years Active: 2007
Title: Sudipto Neogi: Innovator in Electronic Packaging Technology
Introduction
Sudipto Neogi is a prominent inventor based in San Jose, CA, known for his contributions to electronic packaging technology. With a total of 2 patents, he has made significant advancements in the field, particularly in pressure release mechanisms for electronic packages.
Latest Patents
Neogi's latest patents include the "IC package pressure release apparatus and method" and the "Windowed package for electronic circuitry." The first patent describes an apparatus and method for releasing pressure within a package that includes a substrate with an attached die, a lid, and a sealant arranged in a specific pattern. The second patent similarly addresses pressure release in electronic packages, emphasizing the importance of effective sealing and pressure management.
Career Highlights
Sudipto Neogi is currently employed at Intel Corporation, where he continues to innovate and develop new technologies in electronic packaging. His work has been instrumental in enhancing the reliability and performance of electronic devices.
Collaborations
Neogi collaborates with talented individuals such as Biswajit Sur and Boon Seng Tan, contributing to a dynamic and innovative work environment at Intel Corporation.
Conclusion
Sudipto Neogi's contributions to electronic packaging technology through his patents and work at Intel Corporation highlight his role as a key innovator in the industry. His advancements in pressure release mechanisms are paving the way for more reliable electronic devices.