Company Filing History:
Years Active: 2003-2013
Title: Sudarshan Loyalka: Innovator in Wide Band Gap Materials and Sensing Technologies
Introduction
Sudarshan Loyalka is a prominent inventor based in Columbia, MO (US), known for his significant contributions to the fields of materials science and sensor technology. With a total of three patents to his name, Loyalka has developed innovative methods and systems that enhance the capabilities of various materials and sensing applications.
Latest Patents
Loyalka's latest patents include groundbreaking technologies such as "Systems and methods for co-doping wide band gap materials." This patent describes a method for simultaneously co-doping a wide band gap material with both p-type and n-type impurities, creating a p-n junction within the composite material. The process involves placing a sample with dopants between wide band gap material films, applying a vacuum, heating the sample, and using laser beams to facilitate the diffusion of impurities.
Another notable patent is the "Electrostatic thin film chemical and biological sensor." This invention features an electrostatic thin film that attracts specific biological and chemical agents. The sensor includes a charge collector that gathers charge from surface defects induced by these agents. The sensing system utilizes deep level transient spectroscopy to analyze the charges and identify the agents present in the environment.
Career Highlights
Loyalka has worked at the University of Missouri, where he has contributed to research and development in advanced materials and sensor technologies. His work has been instrumental in pushing the boundaries of what is possible in these fields.
Collaborations
Throughout his career, Loyalka has collaborated with notable individuals such as Robert V Tompson, Jr and Mark A Prelas. These collaborations have further enriched his research and innovation efforts.
Conclusion
Sudarshan Loyalka's work exemplifies the spirit of innovation in materials science and sensor technology. His patents reflect a commitment to advancing these fields and addressing real-world challenges through inventive solutions.