Seoul, South Korea

Suck Ju Jang


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 67(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Suck Ju Jang: Innovator in Semiconductor Bonding Technology

Introduction

Suck Ju Jang is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in bonding methods for semiconductor chips. His innovative approach has paved the way for advancements in the manufacturing of electronic devices.

Latest Patents

Suck Ju Jang holds a patent for a bonding method for semiconductor chips. This invention focuses on providing a bonding method for flip chips, where the circuit part is oriented face-down on a substrate after bonding bumps are formed on the semiconductor chip. The process involves forming gold (Au) bumps through wire ball bonding on aluminum bond pads of the semiconductor chips. Additionally, the Au bumps are coated with a tin/lead (Sn/Pb) alloy, also using wire ball bonding. The Sn/Pb alloy bumps can be re-formed into a desired ball shape through heat treatment in a furnace after applying an activation solvent. Finally, the substrate is bonded to the coated bumps through heat treatment in the furnace.

Career Highlights

Throughout his career, Suck Ju Jang has worked with prominent companies in the semiconductor industry. He has been associated with Anam Industrial Co., Ltd. and Amkor Electronics, Inc., where he has contributed his expertise in semiconductor bonding technologies. His work has been instrumental in enhancing the efficiency and reliability of semiconductor manufacturing processes.

Collaborations

Suck Ju Jang has collaborated with various professionals in the field, including his coworker Seong Min Seo. These collaborations have fostered innovation and have led to the development of advanced bonding techniques in semiconductor technology.

Conclusion

Suck Ju Jang's contributions to semiconductor bonding technology highlight his role as an innovator in the field. His patent for a bonding method for semiconductor chips demonstrates his commitment to advancing technology in the electronics industry. His work continues to influence the development of more efficient and reliable semiconductor manufacturing processes.

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