Tainan, Taiwan

Su-Ming Hsieh


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations by Su-Ming Hsieh in Semiconductor Technology

Introduction

Su-Ming Hsieh is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs and methodologies. His work has led to the development of a unique layout pattern for semiconductor varactors, which has implications for various electronic applications.

Latest Patents

Su-Ming Hsieh holds a patent for a "Layout pattern of semiconductor varactor and forming method thereof." This invention provides a layout pattern that includes multiple varactor units arranged on a substrate. Each varactor unit consists of several fin structures and gate structures that are parallel to one another, along with a gate metal layer that is electrically connected to the gate structures. This innovative design enhances the performance and efficiency of semiconductor devices.

Career Highlights

Hsieh is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His role involves research and development, where he applies his expertise to advance semiconductor technologies. His contributions have been instrumental in the company's ongoing efforts to innovate and improve electronic components.

Collaborations

Su-Ming Hsieh has collaborated with several talented individuals in his field, including Ching-Wen Hung and Peng-Hsiu Chen. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Su-Ming Hsieh's work in semiconductor technology exemplifies the impact of innovative thinking in the electronics industry. His patent and contributions to United Microelectronics Corporation highlight the importance of collaboration and creativity in advancing technology.

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