New York, NY, United States of America

Su Hyun Kim

This inventor holds 1 USPTO granted patent. Top assignee: The Procter Gamble Company. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Su Hyun Kim. Retrieved from https://idiyas.com/inventor/su-hyun-kim-vj73spau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Su Hyun Kim

Introduction

Su Hyun Kim is an accomplished inventor based in New York, NY (US). He has made significant contributions to the field of packaging through his innovative ideas and patents. His work is recognized for its practicality and effectiveness in enhancing product packaging.

Latest Patents

Su Hyun Kim holds a patent for a "Card for Package." This invention showcases his ability to create solutions that meet the needs of consumers and businesses alike. With 1 patent to his name, he continues to push the boundaries of innovation in packaging design.

Career Highlights

Currently, Su Hyun Kim is employed at The Procter & Gamble Company, where he applies his expertise in product development and innovation. His role at such a prestigious company highlights his skills and the value he brings to the team.

Collaborations

Throughout his career, Su Hyun Kim has collaborated with talented individuals, including Stevi Lee Carr and Juan Ameyugo Martin. These partnerships have allowed him to expand his creative horizons and contribute to various projects within the company.

Conclusion

Su Hyun Kim's innovative spirit and dedication to his work have made him a valuable asset in the field of packaging. His contributions continue to influence the industry and inspire future inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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