Company Filing History:
Years Active: 2018-2019
Title: Stig Kallman: Innovator in Printed Circuit Board Technology
Introduction
Stig Kallman is a notable inventor based in Kumla, Sweden. He has made significant contributions to the field of printed circuit board technology, holding 2 patents that showcase his innovative approach to electrical engineering.
Latest Patents
Kallman's latest patents focus on the selective partitioning of via structures in printed circuit boards. The first patent describes an apparatus and medium for selective partitioning of a via to create an electrically isolating portion between two electrically conducting portions. This process involves laminating plating resist layers to the printed circuit board before drilling the hole for the via. After drilling, copper is added to selected portions of the interior of the via in two different processing steps, followed by the removal of undesired copper to achieve the electrically isolating portion. The second patent outlines a similar method for achieving the same result, emphasizing the importance of precise layering and processing in the creation of effective circuit board designs.
Career Highlights
Stig Kallman is currently employed at Telefonaktiebolaget LM Ericsson (publ), a leading telecommunications company. His work there has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in technology that impact various industries.
Collaborations
Kallman collaborates with Tomas Bergsten, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of new ideas and solutions in printed circuit board technology.
Conclusion
Stig Kallman's contributions to printed circuit board technology through his patents and work at Ericsson highlight his role as a key innovator in the field. His dedication to advancing electrical engineering continues to influence the industry positively.