The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Jun. 26, 2018
Applicant:

Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;

Inventors:

Stig Kallman, Kumla, SE;

Tomas Bergsten, Rangedala, SE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); H05K 1/09 (2006.01); C25D 5/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/429 (2013.01); C25D 5/02 (2013.01); C25D 5/022 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/09645 (2013.01); H05K 2203/0713 (2013.01);
Abstract

The embodiments herein relate to an apparatus and medium for selective partitioning of a via in a printed circuit board as to produce an electrically isolating portion between two electrically conducting portions in said via. The apparatus and medium implement a step of prior to drilling the hole for the via, laminating plating resist layers to the printed circuit board at a distance from each other corresponding to a desired length of the electrically isolated portion of the via. After drilling, copper is added to selected portions of the interior of the via in two different processing steps followed by a step of removing undesired copper as to produce the electrically isolating portion.


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