STOCKHOLM, Sweden

Stevin Van Wyk

This inventor holds 1 USPTO granted patent and 3 published patent applications and 2 EPO patents. Top assignee: Telefonaktiebolaget Lm Ericsson (Publ). Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Stevin Van Wyk. Retrieved from https://idiyas.com/inventor/stevin-van-wyk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Stevin Van Wyk: Innovator in Cooling Technology

Introduction

Stevin Van Wyk is a notable inventor based in Stockholm, Sweden. He has made significant contributions to the field of cooling technology, particularly with his innovative designs aimed at improving heat dissipation.

Latest Patents

Stevin holds a patent for a "Cooling device for dissipating heat from an object." This cooling device features a base part designed for contact with the object, along with fins that protrude from the base part. The fins are arranged in two configurations: one for natural convection of air and another for forced convection, allowing for effective cooling regardless of ambient air movement. This dual configuration ensures that the cooling device can provide adequate cooling in various conditions.

Career Highlights

Stevin Van Wyk is currently employed at Telefonaktiebolaget LM Ericsson (Publ), a leading telecommunications company. His work there focuses on developing innovative solutions that enhance the efficiency of electronic devices through improved thermal management.

Collaborations

Stevin collaborates with Mikkel Myhre, contributing to advancements in their field through shared expertise and innovative ideas.

Conclusion

Stevin Van Wyk's contributions to cooling technology exemplify the importance of innovation in enhancing device performance. His patent reflects a thoughtful approach to solving real-world problems related to heat dissipation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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