Lombard, IL, United States of America

Steven P Kearney


Average Co-Inventor Count = 4.7

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Westchester, IL (US) (2015)
  • Lombard, IL (US) (2020)

Company Filing History:


Years Active: 2015-2025

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4 patents (USPTO):Explore Patents

Title: Innovations of Steven P. Kearney

Introduction

Steven P. Kearney is a notable inventor based in Lombard, IL (US). He has made significant contributions to the field of precision nanopositioning systems, holding a total of 4 patents. His work focuses on developing advanced methods and mechanical designs for ultra-high-vacuum applications.

Latest Patents

One of his latest patents is titled "Method and mechanical design of a flexure interface for ultra-high-vacuum nanopositioning Invar base near-zero-length feedthrough." This invention provides a novel flexure interface apparatus for ultrahigh-vacuum (UHV) applications, integrating a UHV metrology base with a flange. The design ensures precision and compactness while maintaining thermal stability during the bakeout process. Another significant patent is "Constrained flexure mechanism and method for manufacturing the same." This patent describes a flexure mechanism composed of thin material structures that stabilize weak-link portions, forming a robust laminar structure.

Career Highlights

Steven Kearney is currently employed at UChicago Argonne, LLC, where he continues to innovate in the field of nanopositioning systems. His expertise and inventions have contributed to advancements in UHV applications, showcasing his commitment to precision engineering.

Collaborations

He has collaborated with notable coworkers, including Deming Shu and Jayson W. Anton, further enhancing the innovative environment at UChicago Argonne, LLC.

Conclusion

Steven P. Kearney's contributions to the field of precision nanopositioning systems through his patents and collaborations highlight his role as a significant inventor. His work continues to influence advancements in ultra-high-vacuum applications.

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