Steven James Corbett

Title: Steven James Corbett: Innovator in Electronic Component Encapsulation

Introduction

Steven James Corbett is a notable inventor based in Montville, NJ (US). He has made significant contributions to the field of electronics, particularly in the area of encapsulating electronic components. His innovative approach has led to the development of a unique patent that enhances the reliability and performance of electronic devices.

Latest Patents

Steven holds a patent for "Applying encapsulating material to substrates." This patent involves providing encapsulated electronic components on a circuit board by creating dams around areas designated for electronic components. The process includes mounting the components within these dams and printing encapsulating material through a stencil to ensure proper coverage over the components and within the dams. This method improves the durability and functionality of electronic assemblies.

Career Highlights

Steven is currently employed at MPM Corporation, where he continues to work on innovative solutions in the electronics sector. His expertise in encapsulation techniques has positioned him as a valuable asset to his team and the company.

Collaborations

Throughout his career, Steven has collaborated with talented individuals such as Richard Godin and Kenneth Burton Gilleo. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Steven James Corbett's contributions to the field of electronics through his patent and work at MPM Corporation highlight his role as an influential inventor. His innovative techniques in encapsulating electronic components are paving the way for advancements in electronic device reliability and performance.