Steven J Wein

Title: **Innovative Contributions of Steven J. Wein in Hyperspectral Imaging**

Introduction

Steven J. Wein, an accomplished inventor based in Sudbury, MA, has made significant strides in the field of imaging technology. With a total of 12 patents to his name, he has developed innovative solutions that enhance the capabilities of hyperspectral imaging. His work demonstrates a unique blend of technical expertise and creativity, which has propelled advancements in various applications.

Latest Patents

Among the latest inventions credited to Steven J. Wein are two groundbreaking patents relating to hyperspectral imaging. The first invention, titled "Apparatus and methods for hyperspectral imaging with parallax measurement," describes an innovative apparatus for line-scan imaging. This technology utilizes a 2D array of light-sensitive detector elements divided into sub-arrays. The electrical circuit within the device determines corrections for parallax, ensuring that images captured by the sub-arrays are perfectly co-aligned. Furthermore, both the 2D array and the parallax-detecting elements are strategically placed on the same substrate chip, which facilitates enhanced image processing and correction capabilities.

The second patented invention, "Apparatus and methods for hyperspectral imaging with on-chip digital time delay and integration," introduces another advanced apparatus designed for line-scan imaging. This invention similarly employs a 2D array of light-sensitive detector elements divided into sub-arrays. An analog amplification and signal conditioning module supports the array, while additional components such as analog-to-digital conversion and digital time-delay and integration (TDI) modules function off the primary array. This configuration allows the TDI modules to obtain hyperspectral images with improved range and higher signal-to-noise ratios, marking a significant advancement in imaging techniques.

Career Highlights

Steven J. Wein has had a distinguished career, contributing his expertise to several notable companies, including BAE Systems Information and Electronic Systems Integration Inc. and Litton Systems, Inc. His work in these organizations has provided him with invaluable experience and insights into the demands of the imaging technology sector.

Collaborations

Throughout his career, Steven has collaborated with several prominent professionals, including James D. Targove and David J. Korwan. These collaborations have not only enriched his innovative work but have also led to the development of advanced technologies that continue to impact the industry positively.

Conclusion

Steven J. Wein's contributions to hyperspectral imaging exemplify the profound impact of innovation in technology. His patents reflect a commitment to enhancing imaging capabilities through scientific advancement, positioning him as a leading figure in his field. As technology continues to evolve, the influence of inventors like Steven will undoubtedly pave the way for future breakthroughs in imaging and beyond.