Company Filing History:
Years Active: 2000-2014
Title: Innovations of Steven Edward Staller
Introduction
Steven Edward Staller is a notable inventor based in Russiaville, Indiana. He has made significant contributions to the field of electronics packaging and microelectromechanical systems (MEMS). With a total of 5 patents to his name, Staller's work has advanced the technology used in electronic devices.
Latest Patents
One of his latest patents is titled "Atomic level bonding for electronics packaging." This invention involves an electronic device assembly that includes a die and a substrate, with the possibility of incorporating a lead frame and a heat spreader. The die is characterized as an electronic device in die form, featuring a polished die region. The substrate also has a polished substrate region that is in direct contact with the polished die region. These polished regions are designed to form an atomic bond, enhancing the reliability of electronic device assemblies.
Another significant patent is the "Method and apparatus for electrically testing and characterizing formation of microelectric features." This invention describes a process where a semiconductor wafer is etched to create an array of MEMS devices alongside test sites that represent critical geometries of these devices. The test sites are equipped with probe contacts that allow for the measurement of resistance and capacitance, providing insights into the effectiveness of the etching process.
Career Highlights
Steven Staller is currently employed at Delphi Technologies, Inc., where he continues to innovate in the field of electronics. His work has been instrumental in developing advanced technologies that improve the performance and reliability of electronic devices.
Collaborations
Staller has collaborated with several talented individuals, including John Carl Christenson and John Emmett Freeman. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Steven Edward Staller's contributions to electronics packaging and MEMS technology highlight his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving electronic device performance through cutting-edge techniques.