The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2014
Filed:
Dec. 05, 2012
Delphi Technologies, Inc., Troy, MI (US);
Ralph S. Taylor, Noblesville, IN (US);
Steven E. Staller, Russiaville, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
An electronic device assembly that includes a die and a substrate, and optionally a lead frame and a heat spreader. The die is characterized as an electronic device in die form, and has a polished die region. The substrate has a polished substrate region in direct contact with the polished die region. The polished die region and the polished substrate region have surface finishes effective to attach the die to the substrate by way of an atomic bond. The lead-frame has a polished lead-frame region, and the heat spreader has a polished heat spreader region. These polished regions may also be attached to the polished die region or the polished substrate region by way of an atomic bond.