This inventor holds 2 USPTO granted patents. Top assignee: Saint-Gobain Performance Plastics Corporation. Active years: 2004-2006.
Company Filing History:
Years Active: 2004-2006
Title: Steven E. Bergerson: Innovator in Thermal Interface Materials
Introduction
Steven E. Bergerson is a notable inventor based in Milford, CT (US). He has made significant contributions to the field of thermal interface materials, holding 2 patents that enhance the efficiency of heat transfer in electronic devices.
Latest Patents
One of his latest patents is for a thermal interface material with a low melting alloy. This innovative composition undergoes a viscoelastic change at microprocessor operating temperatures, effectively transferring heat generated by a heat source, such as a microprocessor, to a heat sink. The composition includes a low melting alloy dispersed in a matrix that comprises a viscoelastic composition, which softens at about the operating temperature of the heat source. This viscoelastic composition may include a thermoplastic elastomer, a compatible hydrocarbon oil, and a tackifying resin. In practical use, the thermal interface composition flows under pressure between the heat source and the heat sink, ensuring optimal thermal contact. When the heat source operates and reaches its designated temperature, the viscoelastic composition softens, and the low melting alloy melts to form a highly thermally conductive, generally homogeneous mixture that readily transfers heat to the heat sink.
Another significant patent by Bergerson is for a self-adhering thermal interface material. This invention further enhances the efficiency of thermal management in electronic applications.
Career Highlights
Steven E. Bergerson is currently associated with Saint-Gobain Performance Plastics Corporation, where he continues to innovate in the field of thermal materials. His work has been instrumental in developing solutions that address the challenges of heat management in modern electronics.
Collaborations
Throughout his career, Bergerson has collaborated with talented individuals such as Charles Balian and Gregg C. Currier. These collaborations have contributed to the advancement of thermal interface technologies.
Conclusion
Steven E. Bergerson's contributions to thermal interface materials demonstrate his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of material science and its application in enhancing electronic device performance.