Company Filing History:
Years Active: 2004-2023
Areas of Expertise:
Title: **Innovations of Steven D Cheng in the Field of Wireless Communication**
Introduction
Steven D Cheng is an esteemed inventor based in San Diego, California, who has made significant contributions to the field of wireless communication. With a remarkable portfolio, Steven holds a total of 45 patents, showcasing his dedication to innovation and problem-solving.
Latest Patents
Among his latest achievements, one of his notable patents is entitled "Multiple Input Multiple Output (MIMO) Based Concurrent Scan of Neighbor Cells." This innovative patent describes methods, systems, and devices that enable the concurrent performance of handoff-related measurements for neighbor cells using MIMO antenna resources. In this example, a mobile device remains in contact with a serving cell while conducting handoff-related measurements of wireless signals from neighboring cells. The first wireless signals are captured using MIMO antenna resources, and subsequently, measurements from second wireless signals are performed simultaneously, optimizing the handoff process.
Career Highlights
Steven D Cheng has held important positions in leading technology companies. He has notably worked at Qualcomm Incorporated and Benq Corporation, where he contributed to advancements in telecommunications and wireless technologies. His expertise has been instrumental in developing solutions that enhance connectivity and user experience.
Collaborations
Throughout his career, Steven has collaborated with esteemed professionals such as Tom Chin and Guangming Shi. Their combined efforts have spurred further innovation within the industry, reflecting the importance of teamwork and collaboration in the invention process.
Conclusion
In conclusion, Steven D Cheng's extensive patent portfolio and significant contributions to wireless communication technologies illustrate his commitment to advancing the industry. His pioneering work not only enhances mobile communication but also sets the stage for future innovations in the realm of connectivity.