Steven Chandler Borrillo

Title: The Innovative Contributions of Steven Chandler Borrillo

Introduction

Steven Chandler Borrillo is a notable inventor based in Rochester, MN (US). He has made significant contributions to the field of technology, particularly in the area of printed circuit boards (PCBs). With a total of 3 patents to his name, Borrillo's work has had a substantial impact on the industry.

Latest Patents

Borrillo's latest patents include a hybrid mechanical drill designed for making vias in laminated printed circuit boards. This innovative system utilizes both a mechanical drill and a laser drill to create precise vias. The mechanical drill first creates a hole to a specific depth, after which the laser drill ablates the remaining resin above the target interconnect layer. Another significant patent focuses on in-situ warpage monitoring during solder reflow to prevent head-in-pillow defects. This system measures warpage in products, such as PCBs, as they pass through a reflow oven, ensuring quality control by sorting products based on predetermined warpage limits.

Career Highlights

Borrillo is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of his notable coworkers include Jennifer I Bennett and Sarah K Czaplewski-Campbell. Their collaborative efforts contribute to the advancement of technology and innovation within the company.

Conclusion

Steven Chandler Borrillo's contributions to the field of technology, particularly in the realm of printed circuit boards, demonstrate his innovative spirit and dedication to quality. His patents reflect a commitment to improving manufacturing processes and ensuring product reliability.