Carrollton, TX, United States of America

Steven Alfred KummerlL

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2026.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Steven Alfred KummerlL: Innovator in Sensor Technology

Introduction

Steven Alfred KummerlL is a notable inventor based in Carrollton, TX (US). He has made significant contributions to the field of sensor technology, particularly through his innovative patent. His work is recognized for enhancing the functionality and efficiency of sensor packages.

Latest Patents

KummerlL holds a patent for "Film covers for sensor packages." This invention involves a sensor package that includes a semiconductor die with a sensor, a mold compound covering part of the die, and a cavity formed in the top surface of the mold compound. The sensor is positioned within this cavity. Additionally, the sensor package features an adhesive that abuts the top surface of the mold compound, along with a semi-permeable film that covers the cavity and is flush with the edges of the mold compound. This design improves the performance and reliability of sensor packages.

Career Highlights

KummerlL is associated with Texas Instruments Corporation, a leading company in the semiconductor industry. His role at Texas Instruments has allowed him to work on cutting-edge technologies that impact various applications in electronics and sensor systems.

Collaborations

Throughout his career, KummerlL has collaborated with talented individuals such as Wai Lee and Sreenivasan Kalyani Koduri. These collaborations have contributed to the advancement of innovative solutions in sensor technology.

Conclusion

Steven Alfred KummerlL is a distinguished inventor whose work in sensor technology has led to valuable patents and advancements in the field. His contributions continue to influence the development of efficient sensor packages.

Profile summary based on public USPTO records.
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