Schiller Park, IL, United States of America

Steve Smith

This inventor holds 1 USPTO granted patent. Top assignee: Arpac, LLC. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Steve Smith. Retrieved from https://idiyas.com/inventor/steve-smith-z8gk3uk4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2021

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Steve Smith - Innovator in Heat Shrink Technology

Introduction

Steve Smith is a notable inventor based in Schiller Park, IL (US). He has made significant contributions to the field of packaging technology, particularly with his innovative designs that enhance efficiency and functionality.

Latest Patents

One of Steve Smith's key inventions is the heat shrink tunnel, which is designed to improve the packaging process. This patent features a width adjustment mechanism that includes a pair of opposing side wall assemblies. Each assembly consists of an outer wall and an inner perforated wall that defines a plenum between them. The design allows for the side wall assemblies to be movable toward and away from each other, creating a customizable product path. The tunnel is equipped with a heater/blower assembly in each side wall, directing heat into the product path. Additionally, a shroud extends over the side wall assemblies, ensuring efficient heat distribution. The conveyor system integrated into the design facilitates the smooth conveyance of items through the heat shrink tunnel. Steve holds 1 patent for this innovative technology.

Career Highlights

Steve Smith is currently employed at Arpac, LLC, where he continues to develop and refine packaging solutions. His work at Arpac has allowed him to apply his inventive skills in a practical setting, contributing to advancements in the industry.

Conclusion

Steve Smith's contributions to heat shrink technology exemplify the impact of innovation in packaging solutions. His patent for the heat shrink tunnel showcases his ability to enhance efficiency in the packaging process.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…