This inventor holds 1 USPTO granted patent. Top assignee: Baker Hughes Holdings LLC. Active years: 2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024
Title: The Innovative Contributions of Stephen Rehn
Introduction
Stephen Rehn is a notable inventor based in Milford, MA (US). He has made significant contributions to the field of ultrasonic technology. His work focuses on developing systems that enhance signal processing and data sampling.
Latest Patents
Stephen Rehn holds a patent for an Ultrasonic Bundle System. This innovative system utilizes ultrasonic probes designed to abate unwanted signal noise. The ultrasonic probe consists of a bundle of rods that sample data at one end and propagate a signal encoding the sampled data to the other end. Each rod in the bundle has a substantially similar length and diameter, ensuring uniformity in performance. Additionally, the probe features a shell that is concentrically disposed around the bundle of rods, which helps to pack them together. The shell is equipped with grooves that are specifically designed to mitigate a prevailing bulk wave sampled by the first end.
Career Highlights
Stephen Rehn is currently employed at Baker Hughes Holdings LLC, where he continues to innovate and develop advanced technologies. His work has contributed to the company's reputation for excellence in engineering and technology solutions.
Collaborations
Stephen has collaborated with talented individuals such as Generoso Polcaro and Oleg Khrakovsky. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Stephen Rehn's contributions to ultrasonic technology exemplify the spirit of innovation. His patent for the Ultrasonic Bundle System showcases his commitment to enhancing signal processing capabilities. Through his work at Baker Hughes Holdings LLC, he continues to push the boundaries of technology and engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
