Location History:
- Pearl City, IL (US) (2006 - 2007)
- Xenia, OH (US) (2007 - 2008)
Company Filing History:
Years Active: 2006-2008
Title: Innovations of Stephen R. Shiffer
Introduction
Stephen R. Shiffer is a notable inventor based in Xenia, Ohio, with a remarkable portfolio of 12 patents. His work primarily focuses on advanced sensor packaging technologies, which have significant applications in various industries.
Latest Patents
One of his latest patents is titled "High temperature package flip-chip bonding to ceramic." This invention discloses a sensor package apparatus that includes a sensor die based on a substrate. An integrated circuit is associated with the sensor die, and a leadframe is connected by at least one weld to both the integrated circuit and the substrate. The configuration of the integrated circuit, leadframe, and sensor die in a flip-chip arrangement ensures robust electrical and physical connections, protecting the sensor die effectively. The integrated circuit can be made from materials such as silicon carbide, and a metallization layer adheres to the integrated circuit via welds.
Another significant patent is "Torque sensor packaging systems and methods." This invention involves a torque member with holes for receiving fasteners associated with a sensing element. The sensing element is connected to the torque member, allowing for the transfer of torque to the sensing element for accurate torque sensing operations.
Career Highlights
Stephen R. Shiffer is currently employed at Honeywell International Inc., where he continues to innovate and contribute to the field of sensor technology. His extensive experience and expertise have made him a valuable asset to the company.
Collaborations
Throughout his career, Stephen has collaborated with notable colleagues, including James D. Cook and James Z. T. Liu. These collaborations have further enhanced his work and contributed to the development of innovative technologies.
Conclusion
Stephen R. Shiffer's contributions to sensor packaging technologies through his patents demonstrate his significant impact on the field. His work at Honeywell International Inc. and collaborations with esteemed colleagues highlight his dedication to innovation and excellence.