This inventor holds 1 USPTO granted patent. Top assignee: Printpack Illinois, Inc.. Active years: 2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024
Title: The Innovative Mind of Stephen Jay Balschi, III
Introduction
Stephen Jay Balschi, III is an accomplished inventor based in Acworth, GA (US). He has made significant contributions to the field of packaging materials, particularly with his innovative approach to printing techniques. His work has led to the development of a unique patent that addresses common challenges in the industry.
Latest Patents
Stephen holds a patent for a "Packaging material with concealed plate breaks." This invention introduces a method of printing a product where a plate gap can be at least partially concealed. The design minimizes the presence of trap lines, which are often visible in printed materials. The background of each impression is printed to include a gradient region along the leading and trailing edges adjacent to the plate gap. An overprint ink/layer is applied over the plate gap and portions of the background gradient regions. This innovative approach softens or obscures the appearance of any trap lines, enhancing the overall aesthetic of the printed product. Stephen has 1 patent to his name.
Career Highlights
Stephen is currently employed at Printpack Illinois, Inc., where he continues to develop and refine packaging solutions. His expertise in printing technology has made him a valuable asset to the company. His work not only improves product presentation but also addresses practical challenges faced by manufacturers.
Collaborations
Stephen collaborates with various professionals in his field, including his coworker David Welch. Together, they work on advancing packaging technologies and exploring new methods to enhance product quality.
Conclusion
Stephen Jay Balschi, III exemplifies innovation in the packaging industry through his inventive solutions and collaborative spirit. His contributions continue to shape the future of packaging materials, making a lasting impact on the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile