Hessdorf, Germany

Stefan Nendel


 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Stefan Nendel in Ultrasound Measurement Technology.

Introduction

Stefan Nendel is a notable inventor based in Hessdorf, Germany. He has made significant contributions to the field of measurement technology, particularly in the development of ultrasound measuring assemblies. His innovative approach has led to advancements that enhance the accuracy and efficiency of detecting wall thickness in pipes.

Latest Patents

Stefan Nendel holds a patent for an "Ultrasound measuring assembly and method for detecting the wall thickness of a pipe." This invention features a measuring assembly that includes an ultrasonic probe and a testing head. The testing head is designed with a main element that supports the ultrasonic probe, along with two wing elements that can pivot to adjust their position. This design allows for synchronous movement of the wing elements, facilitating precise measurements of pipe wall thickness.

Career Highlights

Stefan Nendel is associated with Siemens Aktiengesellschaft, a leading global technology company. His work at Siemens has allowed him to apply his innovative ideas in a practical setting, contributing to the company's reputation for excellence in engineering and technology.

Collaborations

Stefan has collaborated with notable colleagues, including Michael Clossen-von Lanken Schulz and Stefan Frank. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Stefan Nendel's contributions to ultrasound measurement technology exemplify the impact of innovation in engineering. His patent for detecting pipe wall thickness showcases his commitment to advancing measurement techniques. Through his work at Siemens and collaborations with fellow inventors, he continues to push the boundaries of technology.

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