This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2019.
Company Filing History:
Years Active: 2019
Title: The Innovative Contributions of Stefan Machiener
Introduction
Stefan Machiener is a notable inventor based in Kissing, Germany. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative solutions that enhance the efficiency and functionality of semiconductor packages.
Latest Patents
Stefan Machiener holds a patent for a molded semiconductor package with C-wing and gull-wing leads. This semiconductor package features a semiconductor die embedded in a molded package body. The design includes leads that are electrically connected to the die and protrude from a side face of the molded package body. A unique recess extends inward from the side face into the bottom main face of the molded package body, forming a single groove. This design allows for a flat region on the side face where the leads exit in the same plane. A first subset of the leads is bent inward and seated in the groove, creating a first row of leads for surface mounting. Meanwhile, a second subset of the leads extends outward, forming a second row of leads also configured for surface mounting. This innovative design enhances the performance and reliability of semiconductor packages.
Career Highlights
Stefan Machiener is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to collaborate with other talented professionals in the field. His contributions have been instrumental in advancing the company's technological capabilities.
Collaborations
Stefan has worked alongside notable colleagues such as Cher Hau Danny Koh and Hai Sin Chong. Their collaborative efforts have fostered an environment of innovation and creativity within the company.
Conclusion
Stefan Machiener's contributions to semiconductor technology exemplify the impact of innovative thinking in the industry. His patent for a molded semiconductor package showcases his ability to solve complex engineering challenges. Through his work at Infineon Technologies AG, he continues to push the boundaries of what is possible in semiconductor design.