Company Filing History:
Years Active: 2021
Title: Discovering the Innovations of Stefan Leitinger
Introduction
Stefan Leitinger is an inventive mind based in Deutschlandsberg, Austria, who has made significant contributions to the field of technology. With a keen focus on creating innovative solutions, he has secured a patent that showcases his expertise in integrated device packaging.
Latest Patents
Stefan Leitinger holds a notable patent for a "Package comprising a substrate that includes a stress buffer layer." This invention includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer that safeguards the integrated device. The substrate is designed with at least one dielectric layer and features multiple interconnects, along with a buffer dielectric layer and a buffer interconnect, providing enhanced performance and durability.
Career Highlights
Leitinger's career is notably tied to Qualcomm Incorporated, a leader in wireless technology and telecommunications. His role at Qualcomm allows him to work on cutting-edge innovations that push the boundaries of device integration and packaging solutions.
Collaborations
In the course of his career, Stefan has collaborated with talented coworkers such as Sebastian Brunner and Kurt Wiesbauer. Together, they have contributed to advancing technological innovations, further exemplifying the importance of teamwork in driving successful projects.
Conclusion
Stefan Leitinger's contributions to the field of technology through his patent and collaborative efforts at Qualcomm Incorporated illustrate the vital role of inventors in shaping the future. His innovative solutions not only enhance device performance but also inspire others in the technology industry to explore new possibilities.