Cedar Park, TX, United States of America

Stanley A Cejka

This inventor holds 1 USPTO granted patent. Top assignee: Freescale Semiconductor,inc.. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Stanley A Cejka. Retrieved from https://idiyas.com/inventor/stanley-a-cejka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 5.0

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Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: The Innovations of Stanley A. Cejka

Introduction

Stanley A. Cejka is a notable inventor based in Cedar Park, TX (US). He has made significant contributions to the field of integrated circuits, particularly with his innovative designs that enhance device integrity. His work is recognized within the industry, and he is associated with Freescale Semiconductor, Inc.

Latest Patents

Cejka holds a patent for an "Integrated circuit interconnect crack monitor circuit." This circuit device is mounted on a substrate and includes a detection circuit that monitors a characteristic of a return signal to determine the integrity of various interconnects of the device. This invention plays a crucial role in ensuring the reliability of integrated circuits.

Career Highlights

Throughout his career, Stanley A. Cejka has demonstrated a commitment to advancing technology in the semiconductor industry. His work at Freescale Semiconductor, Inc. has positioned him as a key player in the development of innovative circuit solutions.

Collaborations

Cejka has collaborated with notable colleagues such as Steven A. Atherton and William J. Downey. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Stanley A. Cejka's contributions to integrated circuit technology exemplify the impact of innovation in the semiconductor industry. His patent and collaborations highlight his dedication to enhancing device integrity and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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