Bochum, Germany

Stanislaus Kandula

This inventor holds 1 USPTO granted patent. Top assignee: Battenfeld Gmbh. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Stanislaus Kandula. Retrieved from https://idiyas.com/inventor/stanislaus-kandula

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Stanislaus Kandula: Innovator in Injection Molding Technology

Introduction

Stanislaus Kandula is a notable inventor based in Bochum, Germany. He has made significant contributions to the field of injection molding technology. His innovative designs have improved the efficiency and effectiveness of manufacturing processes.

Latest Patents

Kandula holds a patent for a "Closing unit for an injection molding machine." This invention includes two end plates, guide crosspieces connecting the end plates, and an intermediate plate that is displaceable longitudinally. The design allows for increased closing force to be applied to the form tool, enhancing the overall functionality of injection molding machines. He has 1 patent to his name.

Career Highlights

Stanislaus Kandula is associated with Battenfeld GmbH, a company known for its advanced machinery in the plastics industry. His work has been instrumental in developing innovative solutions that cater to the evolving needs of manufacturing.

Collaborations

Kandula has collaborated with notable colleagues such as Ralf Kassner and Johann Holzschuh. Their combined expertise has contributed to the advancement of technology in their field.

Conclusion

Stanislaus Kandula's contributions to injection molding technology exemplify the spirit of innovation. His patent and work at Battenfeld GmbH highlight his commitment to improving manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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