Mayfield Heights, OH, United States of America

Stanislau Yakubouski

This inventor holds 1 USPTO granted patent. Top assignee: Ranpak Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Stanislau Yakubouski. Retrieved from https://idiyas.com/inventor/stanislau-yakubouski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Stanislau Yakubouski and Automated Pouch Packaging Innovation.

Introduction

Stanislau Yakubouski is an inventor associated with Mayfield Heights, Ohio, and Ranpak Corporation. His patent work focuses on automated pouch packaging and the conversion of expanded slit-sheet material into protective dunnage.

Latest Patents

Yakubouski is credited with 1 patent: “Apparatus and Method for Making a Pouch Package.” The invention describes an automated system that layers upper and lower cover sheets around expanded slit-sheet material. A cross-pressure applicator bonds the layers with adhesive to create a strip of expanded dunnage.

The apparatus then folds the strip at a crosswise crease so that one portion overlays another. It bonds the strip’s opposite longitudinal sides by compressing them along adhesive locations, forming a pouch package.

Career Highlights

Yakubouski’s listed patent demonstrates an approach to integrating dunnage conversion and pouch formation in an automated process. The design combines material layering, adhesive bonding, folding, and side sealing.

Collaborations

Yakubouski is associated with Ranpak Corporation. His listed coworkers include Robert C. Cheich and Dennis J. Wagner.

Conclusion

Stanislau Yakubouski’s patent describes an automated method for turning expanded dunnage and cover materials into a bonded pouch package.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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