Tonawanda, NY, United States of America

Stan Serwon

This inventor holds 1 USPTO granted patent. Top assignee: Moore North America, Inc.. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Stan Serwon. Retrieved from https://idiyas.com/inventor/stan-serwon-crdvyvcd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 93(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Stan Serwon

Introduction

Stan Serwon is a notable inventor based in Tonawanda, NY (US). He has made significant contributions to the field of technology, particularly in the area of RFID and EAS devices. His innovative approach has led to the development of a unique patent that enhances the usability of labels in packaging.

Latest Patents

Stan Serwon holds a patent for an RFID or EAS label mount with double-sided tape. This invention features a label that includes an EAS device or an RFID device. The label has a first face with human-readable indicia and a second face equipped with pressure-sensitive repositional adhesive. This design allows the label to be easily attached to a package and removed without leaving residue, making it reusable for future shipments.

Career Highlights

Stan is currently employed at Moore North America, Inc., where he continues to innovate and develop new solutions in the field of labeling technology. His work has been instrumental in improving the efficiency of packaging and shipping processes.

Collaborations

Some of Stan's coworkers include Fran Smith and Jerome Cross, who contribute to the collaborative environment at Moore North America, Inc. Their teamwork fosters creativity and innovation in their projects.

Conclusion

Stan Serwon's contributions to the field of labeling technology through his patent demonstrate his innovative spirit and commitment to improving packaging solutions. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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