Location History:
- Costa Mesa, CA (US) (2014)
- Bengaluru, IN (2012 - 2017)
Company Filing History:
Years Active: 2012-2017
Title: Innovations by Srinivasulu Alampally
Introduction
Srinivasulu Alampally is a notable inventor based in Bengaluru, India. He has made significant contributions to the field of multi-die chip modules (MCM) with a total of 4 patents to his name. His work primarily focuses on enhancing the testing capabilities of integrated circuits.
Latest Patents
One of his latest patents is centered around scan-based MCM interconnect testing. This innovation involves a multi-die chip module that includes a first die with a test controller and a second die with another test controller. These dies are interconnected, allowing for advanced testing configurations. The first test controller can place the first die in either a shift mode or a capture mode, while the second controller manages the second die in a similar manner. After a scan shift operation, the scan cells are initialized to predetermined values. During the capture operation, one die remains in the shift mode while the other enters the capture mode. This setup enables efficient at-speed testing of the interconnect by capturing signals on input pads associated with the die in capture mode.
Career Highlights
Srinivasulu Alampally is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of MCMs, making them more efficient and reliable.
Collaborations
He has collaborated with several talented individuals, including Swathi Gangasani and Rubin Ajit Parekhji. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Srinivasulu Alampally's contributions to the field of integrated circuit testing through his patents and collaborations highlight his role as a significant inventor in the technology sector. His work continues to influence advancements in multi-die chip modules, showcasing the importance of innovation in engineering.