Bengaluru, India

Srinivas Tokur Mohana

USPTO Granted Patents = 4 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2023-2025

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4 patents (USPTO):

Title: Innovations of Srinivas Tokur Mohana

Introduction

Srinivas Tokur Mohana is a notable inventor based in Bengaluru, India. He has made significant contributions to the field of technology, particularly in the area of substrate processing. With a total of four patents to his name, Mohana has demonstrated a commitment to innovation and problem-solving in his work.

Latest Patents

One of his latest patents is a bottom cover plate designed to reduce wafer planar nonuniformity. This invention addresses the issue of uneven heating of substrates during processing, which can lead to inconsistent material deposition. The bottom cover plate (BCP) enables better control of radiation loss from a heating element inside a processing chamber. By correcting uneven heating, the BCP helps minimize excess processing and waste from improperly processed substrates. Another notable patent is the shadow ring lift pin, which further enhances substrate processing efficiency.

Career Highlights

Mohana is currently employed at Applied Materials, Inc., a leading company in the field of materials engineering. His work at Applied Materials has allowed him to focus on developing innovative solutions that improve manufacturing processes. His contributions have been instrumental in advancing the technology used in substrate processing.

Collaborations

Throughout his career, Mohana has collaborated with talented individuals such as Zubin Huang and Sandesh Yadamane. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Srinivas Tokur Mohana is a distinguished inventor whose work has significantly impacted the field of substrate processing. His innovative patents and collaborations reflect his dedication to advancing technology and improving manufacturing processes.

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