Srikanth Kulkarni

Title: Innovations of Srikanth Kulkarni in Semiconductor Technology

Introduction

Srikanth Kulkarni is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of semiconductor technology. His innovative work focuses on improving adhesive control techniques in semiconductor devices.

Latest Patents

Kulkarni holds a patent for "Techniques for adhesive control between a substrate and a die." This patent describes semiconductor devices that employ techniques configured to control adhesive application between a substrate and a die. In one implementation, a sacrificial layer is provided on the top surface of the die to protect the surface and bond pads from spill-over of the adhesive. The sacrificial layer and spill-over adhesive are subsequently removed from the die and/or chip carrier. Additionally, the die includes a die attach film (DAF) on its bottom surface for adhering the die to the cavity of the substrate. The die is applied to the cavity with heat and pressure, causing a portion of the DAF to flow from the bottom surface of the die to a sloped surface of the substrate cavity. Kulkarni has 1 patent to his name.

Career Highlights

Kulkarni is currently employed at Maxim Integrated Products, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor devices.

Collaborations

Some of his coworkers include Vivek Swaminathan Sridharan and Khanh Tran, who contribute to the collaborative environment at Maxim Integrated Products, Inc.

Conclusion

Srikanth Kulkarni's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the field. His work continues to influence the development of more efficient semiconductor devices.