Company Filing History:
2 out of 465 
2 out of 633 
1 out of 5,879 
Years Active: 2012-2024
Title: Innovations of Sridhar Idapalapati
Introduction
Sridhar Idapalapati is a notable inventor based in Singapore, recognized for his contributions to the field of composite materials and interconnect reliability. With a total of three patents to his name, he has made significant advancements in methods that enhance the durability and functionality of hybrid composite blades and interconnect structures.
Latest Patents
One of his latest patents is titled "Method of metal work repair in hybrid composite blades." This innovative method focuses on repairing composite blades that include a metal work bonded to a composite part through an adhesive layer. The process involves determining a locally damaged portion of the metal work, removing the damaged section, and reconditioning the exposed surfaces before applying adhesive layers and bonding a metal work patch.
Another significant patent is "Enhancing metal/low-K interconnect reliability using a protection layer." This invention introduces a protection layer that is coated over the interconnect structure, which consists of a metal line and a low-K material. The protection layer, which includes carbon nanotubes, helps to prevent damage to the interconnect structure by reducing the risk of collapse or delamination.
Career Highlights
Sridhar has worked with prominent organizations such as STMicroelectronics Asia Pacific Pte Limited and Nanyang Technological University. His experience in these institutions has allowed him to develop and refine his innovative ideas, contributing to advancements in technology and materials science.
Collaborations
Throughout his career, Sridhar has collaborated with talented individuals, including Tong Yan Tee and Xueren Zhang. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Sridhar Idapalapati's work exemplifies the spirit of innovation in the fields of composite materials and interconnect reliability. His patents reflect a commitment to enhancing technology and improving the performance of critical components in various applications.