Company Filing History:
Years Active: 2025
Title: Sri Priyanka Tunuguntla: Innovator in Semiconductor Technology
Introduction
Sri Priyanka Tunuguntla is a notable inventor based in Portland, OR (US). He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique apparatus that enhances the efficiency of semiconductor chip packages.
Latest Patents
Sri Priyanka Tunuguntla holds 1 patent for his invention titled "Semiconductor chip package thermo-mechanical cooling assembly." This apparatus includes a back plate and a bolster plate secured with a back bolt. The bolster plate features a window, allowing for the integration of a circuit board and a semiconductor chip package. The design also incorporates a load stud and a heat sink, which work together to improve thermal management in semiconductor applications.
Career Highlights
Sri Priyanka Tunuguntla is currently employed at Intel Corporation, a leading company in semiconductor manufacturing. His role at Intel has allowed him to work on cutting-edge technologies that drive innovation in the industry. His expertise in thermo-mechanical cooling solutions has positioned him as a valuable asset to his team.
Collaborations
Throughout his career, Sri Priyanka has collaborated with talented individuals such as Olaotan Elenitoba-Johnson and Eric Erike. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Sri Priyanka Tunuguntla's contributions to semiconductor technology exemplify the spirit of innovation. His patent for a thermo-mechanical cooling assembly showcases his commitment to enhancing the performance of semiconductor devices. His work at Intel Corporation continues to influence the future of technology.