Bengaluru, India

Soumendra K Basu

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Innovations by Soumendra K Basu in Adhesive Bonding Technology

Introduction

Soumendra K Basu is an accomplished inventor based in Bengaluru, India. He has made significant contributions to the field of adhesive bonding, particularly in the automotive industry. His innovative approach addresses common challenges associated with adhesive applications in vehicle manufacturing.

Latest Patents

One of Soumendra K Basu's notable patents is focused on the adhesive bonding of vehicle external panels to reduce bond-line read-out. This patent describes a method that utilizes polymeric panels bonded with thermosetting adhesive compositions. The invention aims to minimize the unsightly appearance of adhesive bond lines on the external surfaces of joined articles. By incorporating filler particles characterized by nanometer-sized clay platelets, the bond-line read-out can be reduced or eliminated, provided that the filler content does not exceed about five percent by volume of the uncured adhesive. Additionally, the selective placement of adhesive extending to the edges of the bonding surfaces further enhances the aesthetic quality of the finished product.

Career Highlights

Soumendra K Basu is currently employed at Gm Global Technology Operations LLC, where he continues to develop innovative solutions in adhesive technology. His work has garnered attention for its practical applications in improving the quality and appearance of automotive components.

Collaborations

Throughout his career, Soumendra has collaborated with talented professionals, including Jessica A Schroeder and Hamid Ghavami Kia. These collaborations have contributed to the advancement of adhesive technologies and have fostered a creative environment for innovation.

Conclusion

Soumendra K Basu's contributions to adhesive bonding technology demonstrate his commitment to innovation and excellence in the automotive industry. His patent on reducing bond-line read-out showcases his ability to solve complex problems through inventive solutions.

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