The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2010

Filed:

Aug. 31, 2007
Applicants:

Soumendra K. Basu, Bangalore, IN;

Jessica A. Schroeder, Sterling Heights, MI (US);

Hamid G. Kia, Bloomfield Hills, MI (US);

Inventors:

Soumendra K. Basu, Bangalore, IN;

Jessica A. Schroeder, Sterling Heights, MI (US);

Hamid G. Kia, Bloomfield Hills, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/00 (2006.01); B32B 37/24 (2006.01); B32B 7/14 (2006.01); B32B 37/00 (2006.01); A61F 13/15 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

The bonding of polymeric panels with thermosetting adhesive compositions may lead to an unsightly image of the adhesive bond line on an external surface of the joined articles. This bond-line read-out is reduced or eliminated using an adhesive material with filler particles characterized by nanometer size clay platelets when the content of the filler particles does not exceed about five percent by volume of the uncured adhesive. Selective placement of the adhesive extending to the edges of the bonding surfaces of the polymeric members also reduces bond-line read-out.


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